Tape Application Guide

  1. Thoroughly clean all substrates.
    • Use a 50/50 mixture of isopropyl alcohol (rubbing alcohol) & water.
      • Both surfaces should be absolutely 100% clean and dry, free from any/all residue or debris. Any residue or debris remaining on either substrate will drastically decrease or prohibit the tape’s ability to create a full strength adhesive bond.
    • Adhesion promoter is always recommended for increased adhesion strength.
      • Applying Adhesion Promoter:
      • After cleaning all surfaces thoroughly, apply a thin layer of adhesion promoter to both substrates & allow the adhesion promoter to fully evaporate before applying the tape.
  2. Applying the tape:
    • - Ideal tape application temperature range: 70° - 100°F (21ºC to 38ºC)
      - To further increase the adhesion strength or lower the surface area tension, use a scuff pad to rough up the
      substrates. Thoroughly clean all debris caused by scuffing and repeat the application process from step one.
      - Make sure to get the exact placement of the tape right the first time, if the tape is separated from the substrate and re-applied the ability to bond with the substrate is compromised & the whole process should be started over again with a new piece of tape & newly cleaned surfaces.
    • Leaving the liner on one side of the tape, apply the exposed side to the first substrate.
      • Use existing liner to apply adequate pressure to the tape.
      • Using a tape roller can help to apply pressure quickly & evenly along the entire tape surface.
      • For best results, 15 PSI of pressure is recommended. In some cases, more pressure will be needed (e.g., rigid &/or irregular surfaces).
      • Keep the tape free from all voids/air pockets. The amount surface area contact successfully made by the outer adhesive layer will greatly increase the overall adhesive bond strength.
    • Remove the existing liner from the tape and apply to the second substrate, also using adequate pressure.
  3. Allow time to fully cure.
    • Product will take 72-96 hours (3-4 days) to fully cure and reach maximum adhesion strength in the ideal temperature range.
    • At the ideal temperature (70° - 95°F), 50% of bond strength will be achieved after 20 minutes. You may be able to accelerate bond strength by raising the temperature. (e.g., 150°F for 1 hour)

Final Notes:

  • We highly recommend that you carry out your own tests to determine the suitability of specification purpose.
  • For the best possible adhesion bond follow each step thoroughly.
  • Neglecting to follow the necessary preparation & application steps only decreases the bonding power of the tape.

Please contact your Sales Representative for assistance or further details.